| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board of which the connection resistance between bump electrodes 13 and conductive layers in opening parts can be reduced because a plurality of bump electrodes 13 arranged for a driving IC 6a are placed in each opening part 15 arranged in input terminals 9aa, 9ab, 9ac, and the new wiring board does not need to be designed and the manufacturing costs can be reduced due to parts cost reduction because driving ICs of different specifications can be mounted. <P>SOLUTION: The source output terminals 8aa, 8ab connected with signal wiring 4a and the source input terminals 9aa, 9ab, 9ac connected with the source input wiring 5a have the opening part 15 individually where the conductive layer is exposed. Each opening part 15 has a size of the extent that a plurality of the bump electrodes 13 provided on the driving ICs 6a are abutted thereon. <P>COPYRIGHT: (C)2003,JPO |
