| 摘要 |
The invention relates to a method for sorting IC components at the back-end of the industrial process according to pre-definable classes of criteria. According to said method the IC components (18) are simultaneously removed from the housings (12) of a supporting plate (10) by various claws (22, 24). A pre-definable access area (28) is allocated to each claw (22, 24) to remove the components from the housings of the supporting plate (10) and the access areas of all of the claws (23, 24) do not overlap. Said supporting plate (10) moves gradually past the claws (22, 24) as each claw (22, 24) removes only the IC components (18) which belong to a specific class of criteria from the housings (12) on the supporting place located inside its respective access area (28).
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