| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resistance layer built-in copper clad laminated sheet equipped with a resistance layer having a high sheet resistance value and hard to generate simultaneous dissolution with copper. <P>SOLUTION: The resistance layer 2 comprising a conductive substance with an electric resistivity of 0.05-2μΩ/m is formed on at least one surface of a substrate copper foil 1, of which both surfaces have surface roughness of 0.5-2.5μm as 10-score average roughness (Rz) prescribed in JIS B 0601, preferably in a thickness of 5-300 mg/m<SP>2</SP>to obtain the copper foil with the resistance layer. The resistance layer built-in copper clad laminated sheet C is obtained by laminating this copper foil with the resistance layer on the single surface or both surfaces of an insulating substrate material D. <P>COPYRIGHT: (C)2003,JPO</p> |
