High performance pin fin heat sink for electronics cooling

摘要

A heat sink for electronic devices comprises a spreader plate having a top surface and having a bottom surface wherein a portion thereof is defined for affixing an electronic device to be cooled thereto. A plurality of columnar pins are spaced apart one from the other in a non-uniform manner and affixed to the top surface of the spreader plate substantially perpendicular thereto. A highly porous heat conducting reticulated foam block substantially fills a space defined by said spaced apart columnar pins.