发明名称
摘要 An area array type semiconductor device employing a single side wiring board in which a signal waveform is not likely to be disturbed even if a higher speed signal is applied includes more ground pads than the number of ground external terminals (ground wire land). The ground wire is formed in a larger width than the other wires on a single side of a substrate so as to form a plane, and gaps between the ground wire and the signal wire or the power wire are set to be substantially equal.
申请公布号 JP3425898(B2) 申请公布日期 2003.07.14
申请号 JP19990196236 申请日期 1999.07.09
申请人 发明人
分类号 H01L23/12;H01L21/48;H01L23/498;H01L23/66;(IPC1-7):H01L23/12 主分类号 H01L23/12
代理机构 代理人
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