| 摘要 |
PROBLEM TO BE SOLVED: To provide a cover-lay film for use in flexible boards such as a fiber- push connection (FPC), equipped with a sufficient adhesive strength and yet capable of preventing in the maximum degree the exudation of the adhesive material at openings in terminals or lands in the circuit pattern. SOLUTION: In this cover-lay film 210, a film substrate 200 is overlaid by two or more adhesive layers different in flow property, with flowability of the layers increasingly higher outward from the film base 200. Bonding of the cover-lay film 210 to a base film 100 and to circuit patterns 120 thereon produces an FPC 300 equipped with a sufficient adhesive strength and yet capable of preventing in the maximum degree the exudation of the adhesive material at openings in the circuit patterns 120. COPYRIGHT: (C)2003,JPO
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