| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component re-forming treatment device which is capable of enabling an electronic component with lead wires to undergo a re-forming treatment in a short time, wherein a large number of electronic components with lead wires are delivered from an electronic component transfer unit to an electronic component re-forming treatment drum unit or from the re-forming treatment drum unit to the electronic component transfer unit at the same time so as to eliminate wasteful waiting time, and the electronic components with lead wires are delivered very efficiently. SOLUTION: A movable pad 2, which is capable of moving to a delivery position RS close to a re-forming treatment drum device 4 and a retreat position SS separate from the re-forming treatment drum device 4 is provided, and an electronic component transfer device 5, on which a large number of holding units 34 are fixed at a prescribed interval, is provided on a wrapping transmission member 6 traveling intermittently on the movable pad 2. The electronic component transfer device 5 is made to approach or recede from the re-forming treatment drum device 4 together with the movable pad 2, and a large number of electronic components 9 with lead wires are delivered at the same time. COPYRIGHT: (C)2003,JPO
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