发明名称 SEALING STRUCTURE, SWITCH, PACKAGE, MEASURING INSTRUMENT AND RADIO EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a sealing structure, a switch, a package, a measuring instrument and radio equipment by which bonding strength is improved while reducing the deterioration of the characteristic of an object to be sealed. SOLUTION: The sealing structure is provided with a glass substrate 301, a signal wire 302 and ground wires 304 formed on this substrate 301, and a glass cap for sealing the substrate 301. The ground wires 304 are provided with notch parts 305 at parts in each of which the glass cap is in contact with the top of the substrate 301. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003197796(A) 申请公布日期 2003.07.11
申请号 JP20010390667 申请日期 2001.12.21
申请人 OMRON CORP 发明人 MASAI MIGAKU;AKIBA AKIRA
分类号 H05K5/00;H01L23/02;H01L23/08;H05K5/06;(IPC1-7):H01L23/02 主分类号 H05K5/00
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