| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To realize the tact-up of a device by uniformly forming the projection and recession of the surface of a substrate such as silicon to be used for a solar battery in the batch of an etching processor. <P>SOLUTION: In this method for roughing a substrate for a solar battery by forming micro-projection and recession on the surface of a substrate for a solar battery by a dry etching method, the conditions of the dry etching include at least two different etching conditions for independently forming the micro-projection and recession, and the means aspect rate of the protruded and recessed face to be formed by the second etching condition of those two etching conditions is set so as to be larger than the mean aspect ratio of the protruded and recessed face to be formed by the first etching condition. <P>COPYRIGHT: (C)2003,JPO</p> |
