| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a semiconductor package or a pressure jig for a lead frame wherein after animal glue is encapsulated with baking, deformation is reduced, and a waste processing rate caused by the failure of a common surface is reduced. SOLUTION: A substrate for a semiconductor package or a pressure jig or a lead frame is characterized in that: a U shaped guide plate 111 is formed on both sides of a box 1, on an inside bottom surface of which a stopper block 112 is provided with a bottom plate 12 left as it is; a built-in bolt 212 is screwed from an upper portion into a front surface of an elongated block 21, and a compression spring 213 is inserted into a lower wide circular recessed groove with a tail end of the bolt 212 screwed into a pressure plate 23 having the same area as that of the bottom plate 12; one-side ends of a pair of L shaped blocks 22 are joined with an edge of a side surface of the elongated block 21 with the other end disposed outside a final end surface of the elongated block 21, and a rotary knob 24 is threaded; and a push pad 242 is engaged to a tail end of a screw 241 connected to the rotary knob 24. COPYRIGHT: (C)2003,JPO |
