| 摘要 |
PROBLEM TO BE SOLVED: To improve the clearness of an identification mark made by laser impression without giving damage such as a crack, breakage or the like to a ceramic package due to the laser impression, to allow the ceramic package adaptable to a thin-thick one, and to reduce a size and a height. SOLUTION: The package for an electronic component is provided with a ceramic substrate 1 mounting an electronic element and a ceramic lid 2 for sealing the mounted electronic element airtightly. On the upper surface of at least one plane of the ceramic substrate or the ceramic lid, a color film H1 having a color different from that of the ceramic substrate or the ceramic lid. Then, the upper surface is irradiated with such a low-power laser which burns up only the color film to form an identification mark M where the ceramic substrate or the ceramic lid is partially exposed. COPYRIGHT: (C)2003,JPO
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