| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package which is easily aligned on an assembly board and enables easy determination of allocation of outer connection pads and can be mounted with little failure and enables an efficient visual inspection after mounting. <P>SOLUTION: The semiconductor package comprises a tabular package base 2a, surface interconnection patterns 63a, 64a, 65a, and 66a disposed on a first principal surface of the package base 2a, a plurality of outer connection pads 31a and 36a disposed on a second principal surface of the package base 2a, a semiconductor chip 1 mounted on the surface interconnection pattern 65a, molding resin 5a formed on the first principal surface so as to seal the semiconductor chip 1, and a plurality of pad display patterns 51a and 56a disposed on the surface of the molding resin 5a so as to correspond to the outer connection pads 31a and 36a. <P>COPYRIGHT: (C)2003,JPO |
