| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a bonding method capable of improving the reliability of a semiconductor device, and stably keeping its quality. <P>SOLUTION: In a bonding method, a tip end 22 of a wire 20 drawn out to the outside from a first tool 30 through which the wire 20 is inserted is formed into a ball shape, and is bonded to a first electrode 12 using the first tool 30. The wire 20 is taken out from the tip end 22, and part 24 of the wire 20 is bonded to a second electrode 16 using the first tool 30. The wire 20 is held with a second tool 32 disposed above the first tool 30, and is torn while the part 24 being left behind on the second electrode 16, and is further taken out to the outside of the first tool 30 by moving the second tool 32 so as to relatively approach the first tool 30 while holding the wire 20. <P>COPYRIGHT: (C)2003,JPO</p> |
