| 摘要 |
PROBLEM TO BE SOLVED: To reduce the difference between electric characteristics of a high frequency circuit constituted of a semiconductor chip in mounting and those in on-wafer evaluating. SOLUTION: The impedance of an input/output circuit 22 for connecting semiconductor chips 10a, 10b is equalized to that of these chips. Specifically, the input/output circuit 22 is constituted as a low-pass filter having capacities of capacity circuits 24a, 24b and an inductive component of a gold wire 26 for connecting the chips with each other and these capacities and the inductive component are adjusted to set the impedance. This reduces the change of electric characteristics at on-wafer evaluating to those at mounting. COPYRIGHT: (C)2003,JPO
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