发明名称 BONDING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To easily obtain a clear image inspective of the position of focus point during irradiation with a parallel light beam. <P>SOLUTION: The bonding apparatus comprises a tool 5 for conducting bonding to a work where a wire is inserted, a camera 11 for detecting a work imaging position, a reference member 30 allocated at a predetermined position, and an optical means 40 for guiding the images of the tool 5 and reference member 30 to the camera 11 for positioned detection. An afocal system is formed by the combination of a lens 20 provided in the camera 11 for positioned detection and a lens 44 provided in the optical means 40. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003197671(A) 申请公布日期 2003.07.11
申请号 JP20010400285 申请日期 2001.12.28
申请人 SHINKAWA LTD 发明人 HAYATA SHIGERU
分类号 H01L21/60;G03B17/00 主分类号 H01L21/60
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