| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board in which an electric connection between a board and a semiconductor chip or an on-board position of the semiconductor chip is made accurate, and which can be effectively produced. <P>SOLUTION: Pattern trenches 12c, 12d for wiring circuits 12a, 12b and a cavity 13b for carrying an IC bare chip 13 are thermally formed on an insulating resin film 11 containing a thermoplastic resin. Thereafter, a conductive paste is filled in the pattern trenches 12c, 12d, to form the wiring circuits 12a, 12b. The IC bare chip 13 is provided with a stud bump 13a in a lower part thereof, and is thermocompression-bonded onto the cavity 13b. At this case, the tud bump 13a penetrates through the resin film 11 in a bottom of the cavity 13b and is connected to the corresponding wiring circuit 12a formed in a rear. <P>COPYRIGHT: (C)2003,JPO</p> |
