SEMICONDUCTOR DEVICE, CIRCUIT MODULE WITH SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of specifying the cause of electrical faulty connection under a condition that the device is mounted on a print wiring plate as it is. SOLUTION: The semiconductor device 2 is provided with a base 14 having a terminal surface 4b opposed to the print wiring plate 3 and a plurality of peripheral surfaces 16 extended from the outer peripheral rim of the terminal surface toward the opposite side of the print wiring plate. A plurality of solder balls 8 connected to the pad 29 of the print wiring plate are arrayed on the terminal surface of the base with the shape of a lattice. The solder balls are electrically connected to an IC chip 10. A plurality of wirings 20 electrically connected to the solder balls are arranged on the terminal surfaces of the base. Respective wirings are provided with lead-out units 21 guided from the terminal surface of the base to the peripheral surface of the same while the probe of a tester is contacted with the lead-out units. COPYRIGHT: (C)2003,JPO