| 摘要 |
PROBLEM TO BE SOLVED: To suppress the outbreak of a crack at a bump, etc., for joining a ceramic substrate and an organic printed wiring board by a simple method without markedly increasing the number of parts and the number of processes. SOLUTION: This electronic apparatus comprises an element mounting substrate having a first electrode formed on the rear side of an element mounting surface, a wiring substrate which is arranged so as to face the element mounting substrate across a prescribed interval and which has a second electrode formed at a position facing the first electrode, a meltable member for joining the first electrode with the second electrode, and a resin reinforcing member which is arranged on an outer side than the meltable member for joining the end of the element mounting substrate with the site of a wiring substrate facing this end. The resin reinforcing member desirably has a shape of splaying out outward from the side face of the element mounting substrate. Furthermore, the resin reinforcing member is desirably formed at proper intervals through the periphery of the element mounting substrate. COPYRIGHT: (C)2003,JPO
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