发明名称 SEMICONDUCTOR WAFER GUIDE AND WET TYPE SEMICONDUCTOR CLEANING APPARATUS USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a wafer guide for minimizing the contact potion between the wafer and a center portion fixing groove. SOLUTION: This wafer guide is provided with a pair of side portion supporting bases 30a, 30b being separated with a predetermined interval and having V-shape grooves 31a, 31b formed on the upper surfaces thereof, a center portion supporting base 32 being located between the side portion supporting bases 30a, 30b, projected toward inside, having a center portion fixing groove 33 formed on the upper surface thereof to form one contact line with wafer, and a pair of fixing plates 34a, 34b coupled in both sides of the side portion supporting bases 30a, 30b and the center potion supporting base 32. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003197595(A) 申请公布日期 2003.07.11
申请号 JP20020337824 申请日期 2002.11.21
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 MOON BONG-HO;KO YOSEN;LEE WON-JUN;JUN YONG-MYUNG;HWANG IN-SEAK
分类号 H01L21/306;B08B3/04;H01L21/00;H01L21/304;H01L21/673;(IPC1-7):H01L21/304 主分类号 H01L21/306
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