摘要 |
PROBLEM TO BE SOLVED: To provide a wafer guide for minimizing the contact potion between the wafer and a center portion fixing groove. SOLUTION: This wafer guide is provided with a pair of side portion supporting bases 30a, 30b being separated with a predetermined interval and having V-shape grooves 31a, 31b formed on the upper surfaces thereof, a center portion supporting base 32 being located between the side portion supporting bases 30a, 30b, projected toward inside, having a center portion fixing groove 33 formed on the upper surface thereof to form one contact line with wafer, and a pair of fixing plates 34a, 34b coupled in both sides of the side portion supporting bases 30a, 30b and the center potion supporting base 32. COPYRIGHT: (C)2003,JPO
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