| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning carrying member for cleaning a wafer conductivity inspection device and a cleaning method of the wafer conductivity inspection device using the member. SOLUTION: The carrying member having a cleaning layer for cleaning the inside of the wafer conductivity inspection device is capable of removing a foreign matter of 1μm diameter and larger composed of at least silicon, organic matters, stainless metal, gold, nickel, and aluminium on a wafer carrying system. COPYRIGHT: (C)2003,JPO
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