| 摘要 |
PROBLEM TO BE SOLVED: To keep high throughput, perform highly uniform evacuating and drying processing, and suppress an increase in cost of an evacuating and drying apparatus in a method for evacuating and drying a substrate whose surface is coated with a coating liquid. SOLUTION: For example, this apparatus is provided with (n) air-tight containers for evacuating and drying a semiconductor wafer, and a vacuum pump as a vacuum and exhaust means that has an exhaust capacity of Q and is commonly connected with the air-tight containers. The maximum exhaust flow rate F of the respective air-tight containers at the time when a solvent in a coating liquid evaporates intensively during evacuation and drying is controlled so that the overlapping of timing at Q/n<F≤Q/(n-1) may be established by upto (n-1) units and the remaining air-tight containers start evacuation and drying after drying of the coating liquid is completed first in the (n-1) units. In this case, one vacuum pump with a small Q is used to reduce exhaust loss and to evacuate and dry the air-tight containers, and the semiconductor wafer can be processed every time by the same exhaust flow rate pattern. COPYRIGHT: (C)2003,JPO
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