发明名称 Method for fabricating a semiconductor memory device
摘要 Capacitor devices are formed in an essentially vertically extending fashion in order to achieve an essentially three-dimensional configuration or a configuration extending into the third dimension. A contacting of plug regions is performed after producing the capacitor devices. Such capacitor devices provide an increased integration density in a semiconductor memory device.
申请公布号 US2003129796(A1) 申请公布日期 2003.07.10
申请号 US20020186597 申请日期 2002.07.01
申请人 BRUCHHAUS RAINER;ENDERS GERHARD;HARTNER WALTER;KRONKE MATTHIAS;MIKOLAJICK THOMAS;NAGEL NICOLAS;ROHNER MICHAEL 发明人 BRUCHHAUS RAINER;ENDERS GERHARD;HARTNER WALTER;KRONKE MATTHIAS;MIKOLAJICK THOMAS;NAGEL NICOLAS;ROHNER MICHAEL
分类号 H01L21/02;H01L21/8246;H01L27/115;(IPC1-7):H01L21/824;H01L21/823 主分类号 H01L21/02
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