发明名称 KLEBEFILM ZUM VERBINDEN EINER SCHALTUNG UND EINER LEITERPLATTE
摘要 A heat-active adhesive for a connecting circuit which is used for electrically connecting circuit electrodes facing each other in the pressing direction by heating and pressing the electrodes. The adhesive has an elastic modulus of 100-2,000 MPa at 40 DEG C after adhesion. The adhesive can contain at least an epoxy resin, acrylic rubber, and a latent curing agent. An acrylic rubber having a glycidryl ether group as a molecule is preferably used as the acrylic rubber. <IMAGE>
申请公布号 DE69716270(T2) 申请公布日期 2003.07.10
申请号 DE1997616270T 申请日期 1997.07.15
申请人 HITACHI CHEMICAL CO., LTD. 发明人 WATANABE, ITSUO;TAKEMURA, KENZO;WATANABE, OSAMU;SHIOZAWA, NAOYUKI;NAGAI, AKIRA;KOJIMA, KAZUYOSHI;TANAKA, TOSHIAKI;YAMAMOTO, KAZUNORI
分类号 C09J163/00;H01B1/22;H01L21/60;H05K3/32;(IPC1-7):H05K3/32;H01B1/20;C09J133/14;C09J7/00 主分类号 C09J163/00
代理机构 代理人
主权项
地址