| 摘要 |
PURPOSE: A semiconductor package is made to solve the structural problem of weakening bonding force between a loading plate(10) and a mold compound(60). CONSTITUTION: A package is made to fasten the outer emission of the heat generated in a semiconductor chip(50) through a heat sink(100) exposed to the external, and to block the penetration of humidity effectively which can be proceeded through a bonding interface of a mold compound(60), and also to minimize the ill production rate and to increase the reliability of a product by strengthening the bonding force between a loading plate(10) and the mold compound(60).
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