| 摘要 |
PURPOSE: A plating apparatus of a semiconductor manufacturing equipment is provided to prevent gold from being plated on a metal layer except a bump by improving the structure of a contact pin, and increase the lifetime of a jig and a plating solution while improving the uniformity of the gold plated on the bump by compensating a protecting tube. CONSTITUTION: A plating apparatus includes a power supply jig. The power supply jig is provided with a plus electrode(160) for supplying plus voltage to a wafer, a protecting layer(170) coated on the surface of the plus electrode for protecting the plus electrode from the outside, the first protecting tube(180) for protecting the protecting layer, the second protecting tube(185) for protecting the first protecting tube, a fixing groove(162), and a contact pin(164) formed at the end portion of the plus electrode for contacting a metal layer of the wafer.
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