| 摘要 |
A mold for an integrated circuit package. The mold for an integrated circuit package includes a main cavity, a front cavity, a rear cavity, a plurality of gates and a plurality of air vents. The gates and the air vents are located on two opposite sides of the mold respectively. The front cavity is located between the main cavity and the gates and the rear cavity is located between the main cavity and the air vents. The gates, the front cavity, the main cavity, the rear cavity and the air vents are interconnected so that they share a common inner space. The extension direction of the rear cavity is parallel to the arrangement direction of the air vents, and the extension direction of the front cavity is parallel to the arrangement direction of the gates. The width of the rear cavity is much smaller than the width of the main cavity.
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