发明名称 |
Resistloses Lithographieverfahren zur Herstellung feiner Strukturen |
摘要 |
The invention relates to a resistless lithography method for producing fine structures. According to said method, a semiconductor mask layer (HM) is formed on a carrier material (TM, HM'), and a selective ion implantation (I) is carried out in order to dope selected regions (1) of the semiconductor mask layer (HM). A semiconductor mask which can be used for further structuring is obtained by removing the non-doped regions of the semiconductor mask layer (HM) by means of a wet-chemical process. The invention thus provides a simple and highly precise resistless lithography method for producing structures smaller than 100 nm. |
申请公布号 |
DE10163346(A1) |
申请公布日期 |
2003.07.10 |
申请号 |
DE2001163346 |
申请日期 |
2001.12.21 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
TEWS, HELMUT;FEHLHABER, RODGER |
分类号 |
G03F7/20;B81C1/00;H01L21/027;H01L21/033;H01L21/265;H01L21/306;H01L21/308;H01L21/3213 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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