RESIN COMPOSITION FOR SEALING ELECTRONIC MATERIAL

摘要

PROBLEM TO BE SOLVED: To obtain a resin composition which can lower a crosslinking temperature and shorten a crosslinking time and has excellent storage stability without impairing properties such as adhesiveness, transparency and moisture resistance indispensable as a sealing material for electronic materials. SOLUTION: An ethylene-vinyl acetate copolymer is mixed with an organic peroxide having≥80°C and≤120°C half life period temperature of 10 hours and a crosslinking auxiliary and heated to give a crosslinked molding. COPYRIGHT: (C)2003,JPO