Etching solution for etching porous silicon, etching method using the etching solution and method of preparing semiconductor member using the etching solution

摘要

A method for preparing a semiconductor member comprises: forming a substrate having a non-porous silicon monocrystalline layer and a porous silicon layer; bonding another substrate having a surface made of an insulating material to the surface of the monocrystalline layer; and etching to remove the porous silicon layer by immersing in an etching solution.