发明名称 ESD protection configuration for signal inputs and outputs in semiconductor devices with substrate isolation
摘要 In the ESD protection configuration, in addition to the existing protection configurations, at each supply pad of the supply bus, an ESD diode is also inserted between the power bus with the potential VSSP and the supply bus with the supply potential VDDP. This ESD diode closes the protection path for negative loads between the substrate potential VSSB and the potential VSSP during an ESD stress and limits the voltage difference occurring between the two corresponding buses (the substrate bus and the power bus) to the terminal voltage of the breakdown diode plus the forward voltage of the ESD diode. The ESD diode between the power bus and the supply bus is intended to be operated only in the forward direction. This requires the breakdown voltage of the ESD diode to be significantly above the breakdown voltage of the breakdown diode of the supply bus.
申请公布号 US6590263(B2) 申请公布日期 2003.07.08
申请号 US20020100238 申请日期 2002.03.18
申请人 INFINEON TECHNOLOGIES AG 发明人 GOSSNER HARALD
分类号 H01L27/02;(IPC1-7):H01L23/62 主分类号 H01L27/02
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