| 摘要 |
PURPOSE: A polishing apparatus is provided to form a uniform wax layer on a back side of a wafer by forming a plurality of groove on a ceramic plate and coating a wax thereon to form a wax layer. CONSTITUTION: A polishing apparatus includes a turntable(100), a pad portion(102), a slurry supply portion(104), a ceramic plate(106), and a head portion(108). The turntable is rotated by a predetermined motor. The pad portion polishes one side of a wafer. The slurry supply portion supplies a polishing solution. The ceramic plate is used for fixing the wafer. The head portion presses and rotates the ceramic plate. A plurality of grooves having a predetermined width and a predetermined depth are formed on a front surface of the ceramic plate. A total volume of the grooves is larger than the volume of a wax layer formed between the wafer and the ceramic plate.
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