APPARATUS FOR POLISHING INNER WALL OF HOLE FORMED AT SILICON CATHODE USING WIRES

摘要

PURPOSE: An apparatus for polishing the inner wall of a hole formed at a silicon cathode using wires is provided to be capable of removing particles and micro cracks generated at the inner wall of the hole by using the abrasion between the wire and slurry. CONSTITUTION: A pair of wire fixing jigs(22a,22b) is installed and spaced apart from a silicon cathode(13) for conserving the interval between wires connected through a plurality of holes of the fixing jigs and the silicon cathode. A pair of fixing jig rings are installed at the wire fixing jigs for fixing the wires drawn from the holes of the fixing jig. A wire bolt(25a) is located at the end portion of the fixing jig ring for controlling the tensile force of the wire. A wire moving part(102) is installed for fixing the wire fixing jigs and silicon cathode, and abrading between the holes of the silicon cathode and the wires by moving the wire fixing jigs while jetting slurry at the entire surface of the silicon cathode.