| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost fluorescent character display device using compact semiconductor chips, wherein the semiconductor chips can be arranged without gaps, even when a multi-stage structure, with 3 stages or more, is adopted. SOLUTION: The semiconductor chips 202 have flip-chip structures which have outgoing terminals 205 on rear surfaces CR of the semiconductor chips 202. The outgoing terminals 205 from insides of the semiconductor chips 202 are connected respectively facing connector terminals 206 on a glass substrate 201 with electrically conductive paste 207 on the sides of the rear surfaces CR. Thereby, the front surfaces CF of the semiconductor chips 202 are made only anode electrodes 204 which are painted with a fluorescent material 203. Cost reduction is possible by reducing sizes of the semiconductor chips 202. The close arrangement of the semiconductor chips 202 lengthwise and breadthwise without gaps becomes possible. COPYRIGHT: (C)2003,JPO
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