FILM TYPE INSULATING MATERIAL FOR PRODUCING PCB BY BUILD-UP METHOD

摘要

PURPOSE: A film type insulating material is provided to minimize the deviation of plating thickness and to obtain uniform insulating thickness when an insulating layer is formed in a PCB production process by a build-up method. CONSTITUTION: The film type insulating material comprises a cover film(10), an insulating layer forming film(20) and a Mylar film(30). The film type insulating material is characterized in that the insulating layer forming film(20) has a width less than that of the overlaying cover film(10) by 1 to 10 mm, and a flow interrupting jaw is formed at both ends of the cover film(10) or a flow interrupting dam(40) is formed at both ends of the insulating layer forming film(20) in which the jaw or dam(40) has a height equal to that of the insulating layer forming film(20) and a width of 1 to 10 mm in order to prevent the resin of the insulating layer forming film(20) from outflowing.