发明名称 SOLUTION PROCESSING METHOD, SOLUTION PROCESSING APPARATUS, AND ELECTRO-OPTICAL PANEL
摘要 PROBLEM TO BE SOLVED: To realize highly efficient solution process and particularly realize highly efficient simultaneous solution process of a plurality of substrates by fully utilizing sufficient processing capability of bubbles to the processing surface at the time of solution processing through introduction of bubbles under the condition that the substrate is soaked in the solution. SOLUTION: The solution processing apparatus comprises a cleaning vessel 102 for soaking a substrate 102 in the pure wafer 201, a bubble introducing section 104 for introducing bubbles 200 into the pure water 201 and a cassette 101 for inclining the substrate 102 for the specified angleθso that the bubbles 200 move along the cleaning surface 102a of the substrate 102. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003188140(A) 申请公布日期 2003.07.04
申请号 JP20010383028 申请日期 2001.12.17
申请人 SEIKO EPSON CORP 发明人 IWATA SHINICHI
分类号 G02F1/1333;B08B3/04;B08B5/00;H01L21/304;(IPC1-7):H01L21/304;G02F1/133 主分类号 G02F1/1333
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