| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a high density printed wiring board which is superior in metal foil direct laser beam machining property and in reliability without largely increasing the energy of a laser. <P>SOLUTION: In the metal foil direct laser punching work of a metal foil-clad laminated board and a printed wiring board, metal foil on a surface is etched and it is thinned to not more than 7μm. Then, a surface processing whose surface roughness of an etching system is not more than 4μm is performed. Thus, the high density printed wiring board superior in metal foil direct laser beam machining property and reliability and the manufacturing method can be obtained. <P>COPYRIGHT: (C)2003,JPO</p> |
