METHOD FOR FORMING THIN FILM

摘要

PROBLEM TO BE SOLVED: To transfer a thin film over the entire region of a substrate while preventing incomplete transfer. SOLUTION: A vacuum container 101 is evacuated by means of an evacuation pump 108 to have pressure P1 lower than the pressure P0 suitable for transferring a thin film 104 to a semiconductor substrate 103. Subsequently, a lower plate 107 is elevated by means of a plate driver 109 to touch a base material 105, and then evacuation condition in the vacuum container 101 is controlled such that the pressure P1 can be maintained in the vacuum container 101 or the pressure in the vacuum container 101 is higher than P1 but not higher than P0. COPYRIGHT: (C)2003,JPO