| 摘要 |
<p>PURPOSE: A ceramic package for test is provided to be capable of testing a plurality of semiconductor chips having various sizes at a single semiconductor package. CONSTITUTION: A ceramic body(10) is provided with the first, second, third, and fourth surfaces(1,2,3,4), a plurality of inner terminals(5) formed at the second surfaces, a wiring patterns connected and prolonged from the inner terminals, and a plurality of outer terminals(7) connected with the end portion of each wiring pattern. A ceramic package(101) for test is provided with the ceramic body, semiconductor chips having a plurality of bonding pads(21), respectively, attached on the first surface of the ceramic body, a plurality of conductive wires(30) for electrically connecting between the bonding pads and inner leads of the ceramic body, and a plate type lid attached on the third surface of the ceramic body for protecting each semiconductor chip and the conductive wires.</p> |
