| 摘要 |
PURPOSE: A package stacking structure is provided to stack two to six semiconductor chips on a substrate by stacking a lead type package on a semiconductor package mounted on the substrate. CONSTITUTION: A package stacking structure includes a substrate(30), the first package(40), a connective substrate(60), and the second package(50). The first package has an external connection terminal mounted on one side of the substrate. The connective substrate is formed on the substrate of the outside of the first package. The second package includes a lead mounted on an upper portion of the connective substrate. The connective substrate includes a body(62), a contact pad(63), and a connection pad(65). The contact pad is electrically connected to the first package. The connection pad is electrically connected to the contact pad.
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