发明名称 Mechanical transmission system for automatically breaking off in response to earthquake and method thereof
摘要 A mechanical transmission system for transmitting a wafer to a semiconductor manufacturing machine and being able to break off automatically in response to an earthquake via receiving a control signal generated by an earthquake detecting device is provided. The system includes a mechanical transmission device for transmitting-the wafer to the semiconductor manufacturing machine, a warning device for generating a warning signal in response to the control signal, and a control circuit electrically coupling to the mechanical transmission device and breaking off in response to the control signal for avoiding the damage of the mechanical transmission device or the semiconductor-manufacturing machine caused by the earthquake.
申请公布号 US2003122681(A1) 申请公布日期 2003.07.03
申请号 US20020162453 申请日期 2002.06.04
申请人 WINBOND ELECTRONICS CORP. 发明人 LUAN YI-CHANG;CHIU TSUN-HU;HSUEH CHU-LONG
分类号 H01L21/00;(IPC1-7):G08B21/00 主分类号 H01L21/00
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