发明名称 |
Mechanical transmission system for automatically breaking off in response to earthquake and method thereof |
摘要 |
A mechanical transmission system for transmitting a wafer to a semiconductor manufacturing machine and being able to break off automatically in response to an earthquake via receiving a control signal generated by an earthquake detecting device is provided. The system includes a mechanical transmission device for transmitting-the wafer to the semiconductor manufacturing machine, a warning device for generating a warning signal in response to the control signal, and a control circuit electrically coupling to the mechanical transmission device and breaking off in response to the control signal for avoiding the damage of the mechanical transmission device or the semiconductor-manufacturing machine caused by the earthquake.
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申请公布号 |
US2003122681(A1) |
申请公布日期 |
2003.07.03 |
申请号 |
US20020162453 |
申请日期 |
2002.06.04 |
申请人 |
WINBOND ELECTRONICS CORP. |
发明人 |
LUAN YI-CHANG;CHIU TSUN-HU;HSUEH CHU-LONG |
分类号 |
H01L21/00;(IPC1-7):G08B21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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