发明名称 Semiconductor device equipped with semiconductor circuits composed of semiconductor elements and process for production thereof
摘要 A semiconductor device and a process for production thereof, said semiconductor device having a new electrode structure which has a low resistivity and withstands heat treatment at 400° C. and above. Heat treatment at a high temperature (400-700° C.) is possible because the wiring is made of Ta film or Ta-based film having high heat resistance. This heat treatment permits the gettering of metal element in crystalline silicon film. Since this heat treatment is lower than the temperature which the gate wiring (0.1-5 mum wide) withstands and the gate wiring is protected with a protective film, the gate wiring retains its low resistance.
申请公布号 US2003122121(A1) 申请公布日期 2003.07.03
申请号 US20030338025 申请日期 2003.01.08
申请人 发明人 YAMAZAKI SHUNPEI;FUJIMOTO ETSUKO;ISOBE ATSUO;TAKAYAMA TORU;FUKUCHI KUNIHIKO
分类号 G02F1/136;G02F1/1368;H01L21/28;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/423;H01L29/49;H01L29/786;(IPC1-7):H01L35/24 主分类号 G02F1/136
代理机构 代理人
主权项
地址