| 摘要 |
A semiconductor device has a first chip (10A) fixed and connected to a substrate (30), wherein the first chip (10A) includes redistributions (14) sealed up with an sealing resin (16), for connecting between an integrated circuit formed on the surface of a semiconductor chip (11) and ball pads (15), and solder bumps (17) for connection to the substrate (30), which are respectively mounted on the ball pads (15).
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