| 摘要 |
<P>PROBLEM TO BE SOLVED: To determine quality of interchip connection in semiconductor chips in a multi-chip module, by a simple test circuit and a simple testing method. <P>SOLUTION: A plurality of switch elements 1-31, 1-32, 2-31, 2-32, etc., are arranged to electrify a plurality of connection members 10-1, 10-2, etc., electrically in series, in order to determine the quality the connection between fellow connection pads 1-21 and 2-21, 1-22 and 2-22, etc., between the semiconductor chips 1, 2. When the connection is tested, all the switch elements 1-31, 1-32, 2-31, 2-32, etc., are brought into ON conditions by a probing pad 1-03, and impedances in both ends electrified in series are measured by two probing pads 1-01, 1-02 to determine the quality of the connection between the semiconductor chips 1, 2. <P>COPYRIGHT: (C)2003,JPO |
