Method and apparatus for grounding a processor board

摘要

The present invention is adapted for electrically grounding a printed circuit board to a chassis having mounting studs with each stud having an upper nose. The ground clip of the present invention has a generally circular upper body portion with a side opening, and a plurality of retentive leads extending from the upper body portion. Each ground clip is connected to the circuit board around a portion of a mounting hole such that the upper body portion contacts the upper nose to provide electrical grounding of the circuit board to the chassis.