| 发明名称 |
Memory device packaging including stacked passive devices and method for making the same |
| 摘要 |
Briefly, in accordance with one embodiment of the invention, a memory device package includes an integrated circuit die having a memory array and at least one passive component mounted to the integrated circuit component.
|
| 申请公布号 |
US2003122216(A1) |
申请公布日期 |
2003.07.03 |
| 申请号 |
US20010039439 |
申请日期 |
2001.12.28 |
| 申请人 |
RABADAM ELEANOR P.;LOPEZ CHARLES A.;FOEHRINGER RICHARD B. |
发明人 |
RABADAM ELEANOR P.;LOPEZ CHARLES A.;FOEHRINGER RICHARD B. |
| 分类号 |
H01L23/50;H01L23/64;H01L25/16;(IPC1-7):H01L29/00 |
主分类号 |
H01L23/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
