| 发明名称 |
SEALED LETTER PREPARING APPARATUS |
| 摘要 |
PROBLEM TO BE SOLVED: To decrease a possibility of opening the top and bottom parts of an envelope after heat fusion when the top and bottom parts of the envelope consisting of a film sheet are to be bonded by the heat fusion. SOLUTION: A pressing part 70 for pressing the top and bottom parts of the envelope 1 cut into a letter and fused by heat at a cutting part 40 to a conveyor 60b is provided. COPYRIGHT: (C)2003,JPO |
| 申请公布号 |
JP2003181954(A) |
申请公布日期 |
2003.07.03 |
| 申请号 |
JP20010387943 |
申请日期 |
2001.12.20 |
| 申请人 |
TOPPAN FORMS CO LTD |
发明人 |
TANAKA TAKASHI;YONEYAMA TAKAHIRO;MINAMI YOSHIAKI |
| 分类号 |
B42D15/08;B31B1/10;B31B1/14;B31B1/16;B31B1/64;B31B23/02;B31B23/14;B31B23/60;B65B9/06;B65B9/067;B65B25/14;B65B51/10;B65B51/18;B65B51/32;B65D27/00;(IPC1-7):B31B23/10;B31B23/16 |
主分类号 |
B42D15/08 |
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