| 摘要 |
PROBLEM TO BE SOLVED: To minimize the waveform deformation even for a high frequency of a burn-in signal and easily cope with the change of an IC package. SOLUTION: IC socket parts 21 for mounting semiconductor devices and a circuit blocks 20 each having a switching circuit 22 and a terminator circuit 23 are provided on an IC socket 2 attached to a burn-in card board 1. The IC socket 2 is removably mounted on the burn-in card board 1 having parallel wiring patterns disposed on the backside, each wiring pattern is cut off by portions of the IC socket 2, and the switching circuit 22 connects the cut wiring patterns to each other or the wiring patterns to the terminator circuit 23. The switching circuit 22 of the IC socket on the final stage mounting the semiconductor device is switched to connect the wiring pattern to the terminator circuit 23. COPYRIGHT: (C)2003,JPO
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