发明名称 |
Integrated chip package structure using organic substrate and method of manufacturing the same |
摘要 |
An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.
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申请公布号 |
US2003122243(A1) |
申请公布日期 |
2003.07.03 |
申请号 |
US20020055499 |
申请日期 |
2002.01.22 |
申请人 |
LEE JIN-YUAN;LIN MOU-SHIUNG;HUANG CHING-CHENG |
发明人 |
LEE JIN-YUAN;LIN MOU-SHIUNG;HUANG CHING-CHENG |
分类号 |
H01L21/48;H01L21/60;H01L21/68;H01L23/498;H01L23/538;(IPC1-7):H01L23/053;H01L23/12 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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