| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid resin composition for sealing semiconductor elements, which is greatly improved in a pot life, can be cured in a short time, and is excellent in reliability, and to provide a semiconductor device which is highly productive and reliable. SOLUTION: The liquid resin composition comprises (A) a liquid epoxy resin having two or more epoxy groups, (B) an alkyl-substituted diaminodiphenylmethane and (C) diaminobenzoic acid. The semiconductor device is formed by sealing the semiconductor elements with the liquid resin composition. COPYRIGHT: (C)2003,JPO |
