| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for evaluating whether or not a given electrolytic plating solution is a one that can form an electrolytically plated film of a desired shape. SOLUTION: The method is the one for evaluating an electrolytic plating solution used when a thin film conductor layer is formed on the surface of a substrate having a recessed resin layer and an electrolytically plated film is formed on the thin film conductor layer, and comprises immersing the substrate having the formed thin film conductor layer in an electrolytic plating solution, applying an alternating current between both ends of the thin film conductor layer to measure electrical characteristics, and evaluating the shape of the electrolytically plated film to be formed from the electrical characteristics. COPYRIGHT: (C)2003,JPO |
